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STMicroelectronics, Virscient to Enable Faster Delivery of Connected-Car Systems

Will support ST customers with advanced automotive applications based on the ST Modular Telematics Platform.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

STMicroelectronics has joined forces with Virscient, a provider of hardware and software development services and support for customers building automotive solutions using ST’s Telemaco3P secure telematics and connectivity processors.
 
Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP). MTP is a development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor. MTP enables the rapid prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles.
 
The Telemaco3P incorporates dual Arm Cortex®-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and a rich set of connectivity interfaces.
 
“The Telemaco3P platform enables our customers to deliver new categories and products in automotive telematics,” said Philippe Prats, head of EMEA marketing and application for STMicroelectronics’ Automotive and Discrete products. “By working with Virscient, we make this exciting technology accessible to a broader range of innovative companies.”

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